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| • Replaces all OEM software with PC-based system. • New AFA System that aligns manual levels! • Software change turnaround measured in hours! • Installation is easy. |
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| The OS2000 provides an easy-to-use GUI-based operator interface and advanced machine control. |
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Benefits
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| • High Level System Benefits
• Software Functional Benefits • Overall Wafer Production Enhancements |
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High Level System Benefits |
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| • Higher reliability due to reduction of boards and parts (increases MTBF, lower cost of repair) • Flexible software and easy software modifications due to non prom-based software as well as one software program instead of many • Availability of spare parts; no more reliance on availability of obsolete Multibus boards, etc. (lower cost of repair) • Lowered training costs due to easier-to-use software interface • Lowered service costs; again due to easier-to-use and more capable software interface (lower MTTR) • Increased Production Capacity up to 30% • Available Remote Capabilities as an aid to production or service Replacing the other proprietary boards reduces the effects of obsolete parts and also increases reliability (PC boards generally are made in higher volumes and statistically exhibit higher reliability than custom, low-volume boards). The software control system is written in an object-oriented language to provide increased robustness of software while also reducing the effort necessary for enhancements or customization. |
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Software Functional Benefits |
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| • Active 'watch-dog' processes continually checking for out-of-bounds conditions to prevent mis-processing. Some of these conditions include: loss of vacuums, loss of UV illumination, loss of power supplies • Pre-processing checking to prevent processing with the wrong mask, illegal exposure values, out of balance carriage, wrong UV band, out-of-spec Joystick Nulls Safety behaviors such as: • Pulling back the Focus Actuators on the first wafer to prevent crashing into the Gauge Head, and using the final position as the new Focus Actuator Starting Position for the next wafer. • Restricting Wafer Macrostage moves during First Wafer Setup to prevent IA from moving the Wafer Macrostage to its limits (or the IA Detectors either) • Automatically performing IA Set before expose on First Wafer Setup if not already done. • Undoing 'Expose with Actinic Filter' when Loading a Process (to prevent unwanted processing w/out exposing) • Confirmation of Expose with AFA when de-selecting the AFA button when AFA is called for in the Process • Focus & IA Bypass is a Process parameter rather than a machine setting, thus preventing leaving it on accidentally |
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OS2000 wafer run screen
click on image for full size screen shot |
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Overall Wafer Production Enhancements
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| • New AFA System employing a full-field array CCD camera allowing alignment to a wider range of target shapes and lighting conditions. There is no longer a restriction to the 'Perkin-Elmer Chevron' targets. Previously manual-align-only levels can now by AFA'd, thus increasing machine throughput for that level. • User-type specific AFA windows to gear use of AFA to type of operation being performed (Operator setup vs. Process setup) • Support for variable thickness substrate handling (via extended bellows chuck) • IA-Prealigner Feedback loop to have the Prealigner align to an offset to load wafers on the Chuck closer to the IA Set position and thus reduce Wafer Macrostage travel. • Sensor timeout dialogs identifying specific sensors causing a mechanical stall problem (reducing MTTR) • Added specific interface windows for adjusting a Process for Overlay, Exposure, or Focus. Configurable overlay entry screens to handle differences between Overlay measurements equipment (e.g. KLA vs. IVS) • Upon loading a Mask, if a Process exists that has the same name as the Mask ID, that Process will automatically be loaded. • History and Wafer logs are available to help diagnosis processing problems. • SEMI-GEM compliant host link (SEMI E30-1296 & SEMI E58) |
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Increased Production Results
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| • Increase throughput - Increased processing speed - Decreased setup time -------Mask and Wafer stages go to last setup position -------Parameter setting via download is faster than manual entry • Decreased Rework - Decreased mis-processing ----Process checking prior to processing including: --------Correct Mask --------Valid Dose --------Valid Magnification ----Focus System eliminates hitting the wafer with nozzles with Smart focus - Decreased mis-alignment ----Carriage Balance check to prevent banding ----Tighter alignments on the tougher levels • Decreased downtime - Decreased MTBF ---- Prealigner prevents flexure breakage (similar to M700) ---- Prealigner/IA feedback prevents wafer stage flexure breakage ---- Actuator/Sensor failure reports help prevent catastrophic failures ---- Joystick check at Process start to prevent lockup at Viewing - Decreased Schedule Downtime ---- Exposure Meter procedure runs faster (no calculations and/or mistakes) ---- Uniformity procedure ---- Uniformity flag adjustment (none mechanical adjustment) ---- Focus Matrix & Adjustment (no calculations and/or mistakes) ---- Overlay & Adjustment (no calculations and/or mistakes) ---- Exposure & Adjustment (no calculations and/or mistakes) - Decreased MTBA ---- Retries avoid assists from Operators including: -------- Prealigner Retry -------- AFA Retry -------- Mask Vacuum Retry - Decreased MTTR ---- No more sequencer listing required when machine stops and doesn't say what's wrong ---- Easier, faster repair & diagnostic procedures, (I/O screen with everything available, point and click) |
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Details on parts replacement
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| Below are lists of OEM parts whose use would be eliminated. These parts below are obsolete, and in many cases, custom. Replacing these parts with fewer COTS (commercial off-the-self) parts will result in a double benefit to reliability. Any custom boards that are supplied in the new OS2000 kit are simple interface boards with very few active components. These include the new A14, A19, A699, & A1403 boards. We have not experienced any failures in the field with any of these above boards. Existing Parts Removed: • ASM/AIM Computer • AIM Power Distribution Chassis • ASM/AIM Monitor & power supply • AFA Camera & power supply • A700 Centerframe Electronics • A703 Prealigner Board • A1 AFA CPU Board • A4 AFA Memory Board • A5 AFA Camera Interface Board • A6 AFA Graphics Board • A8 OS CPU Board • A10/11 OS Memory Boards • A12 SEMI-SECS communication board • A13 Bus Interface Board • A14 PE Bus Board • A18 Linear Drive Digital Electronics • A19 Linear Drive Analog Electronics • A108 Strip Display • A101 Carriage Counter Display • A102 Keypad |
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